Electronic packaging and corrosion in microelectronics : proceedings of ASM's Third Conference on Electronic Packaging: Materials and Processes & Corrosion in Microelectronics, Minneapolis, Minnesota, 28-30 April 1987 / edited by Morris E. Nicholson ; sponsored by Electronic Materials and Processing Division of ASM International and Corrosion Research Center of the University of Minnesota in cooperation with the Minnesota Chapter of ASM International ; supported by Twin City Section of NACE, IEEE Reliability Society, IEEE Components, Hybrids and Manufacturing Technology Society.

Saved in:
Bibliographic Details
Published: [Metals Park, Ohio] : ASM International, c1987.
Corporate Authors:
Other Authors:
Subjects:
Format: Conference Proceeding Book

EPS Library, Level 3

Holdings details from EPS Library, Level 3
Call Number Copy Loan Type Status Request
TK 7870 .C748 AU88024404B
For loan Available now Request this copy