1973 IEEE Intercon technical program papers.

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Bibliographic Details
Published: [New York : Institute of Electrical and Electronics Engineers, 1973]
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Format: Book
Detail
Physical Description:1 v. (various pagings) : ill. ; 28 cm.
Notes:Cover title.
"Presented at the Institute of Electrical and Electronics Engineers International Convention and Exposition, March 26-30, 1973."
"Sponsored and organized by the Institute of Electrical and Electronics Engineers."
Bib#: 388905
Language:English
Bib#:388905